Low-melting_alloy

Fusible alloy

A fusible alloy is a metal alloy capable of being easily fused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily, eutectic alloys.

Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 183 °C (361 °F; 456 K). Fusible alloys in this sense are used for solder.

Introduction

From a practical view, low-melting alloys can be divided into the following categories:

Some reasonably well-known fusible alloys are Wood's metal, Field's metal, Rose metal, Galinstan, and NaK.

Applications

Melted fusible alloys can be used as coolants as they are stable under heating and can give much higher thermal conductivity than most other coolants; particularly with alloys made with a high thermal conductivity metal such as indium or sodium. Metals with low neutron cross-section are used for cooling nuclear reactors.

Such alloys are used for making the fusible plugs inserted in the furnace crowns of steam boilers, as a safeguard in the event of the water level being allowed to fall too low. When this happens the plug, being no longer covered with water, is heated to such a temperature that it melts and allows the contents of the boiler to escape into the furnace. In automatic fire sprinklers the orifices of each sprinkler is closed with a plug that is held in place by fusible metal, which melts and liberates the water when, owing to an outbreak of fire in the room, the temperature rises above a predetermined limit.[1]

Bismuth on solidification expands by about 3.3% by volume. Alloys with at least half of bismuth display this property too.[2] This can be used for mounting of small parts, e.g. for machining, as they will be tightly held.[citation needed]

Low-melting alloys and metallic elements

Well-known alloys

More information Alloy, Melting point ...

Other alloys

More information Composition in weight-percent, Melting point ...

See also


References

  1.  One or more of the preceding sentences incorporates text from a publication now in the public domain: Chisholm, Hugh, ed. (1911). "Fusible Metal". Encyclopædia Britannica. Vol. 11 (11th ed.). Cambridge University Press. p. 369.
  2. "F.A.Q." Archived from the original on 2004-08-07.
  3. Oshe, R.W. (ed.), "Handbook of Thermodynamic and Transport Properties of Alkali Metals", Oxford. UK, Blackwell Scientific Publications Ltd, 1985, p. 987
  4. White, Guy Kendall; Meeson, Philip J. (2002). Experimental techniques in low-temperature physics. Clarendon. pp. 207–. ISBN 978-0-19-851428-2.
  5. Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
  6. "Lens Blocking alloy 136 58oC". Archived from the original on 2016-10-17.
  7. François Cardarelli (2008-03-19). Materials Handbook: A Concise Desktop Reference. Springer Science & Business Media. pp. 210–. ISBN 978-1-84628-669-8.
  8. Jensen, William B. (2010-10-01). "The Origin of the Name "Onion's Fusible Alloy"". Journal of Chemical Education. 87 (10): 1050–1051. Bibcode:2010JChEd..87.1050J. doi:10.1021/ed100764f. ISSN 0021-9584.
  9. Charles A. Harper (2003). Electronic materials and processes. McGraw-Hill Professional. pp. 5–8. ISBN 0-07-140214-4.
  10. Karl J. Puttlitz, Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. ISBN 0-8247-4870-0.
  11. Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
  12. "Oregon State University". Oregon State University. Retrieved 2022-04-06.
  13. T.Q. Collier (May–Jun 2008). "Choosing the best bumb for the buck". Advanced Packaging. 17 (4): 24. ISSN 1065-0555.
  14. msl747.PDF. (PDF). Retrieved 2010-07-06.
  15. Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
  16. "Tin-Zinc Solders for Aluminium to Aluminium and Copper". Kapp Alloy & Wire, Inc. Archived from the original on 16 July 2013. Retrieved 23 October 2012.
  17. Madara Ogot, Gul Okudan-Kremer (2004). Engineering design: a practical guide. Trafford Publishing. p. 445. ISBN 1-4120-3850-2.
  18. Howard H. Manko (8 February 2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. pp. 396–. ISBN 978-0-07-134417-3. Retrieved 17 April 2011.

Further reading

  • ASTM B774—Standard Specification for Low Melting Point Alloys. ASTM International. 1900. doi:10.1520/B0774.
  • Weast, R.C., "CRC Handbook of Chemistry and Physics", 55th ed, CRC Press, Cleveland, 1974, p. F-22

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