"Diamondville" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
• Transistors: 47 million
• Die size: 25.96 mm² (3.27 × 7.94)
• Package size: 22 mm × 22 mm

"Pineview" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading
• Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller^[1]
• Transistors: 123 million (single-core), 176 million (dual-core)
• Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core)
• Package size: 22 mm × 22 mm

"Cedarview" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Hyper-Threading (except D2500)
• Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller^[2]
• Package size: 22 mm × 22 mm

"Diamondville" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
• Transistors: 47 million
• Die size: 26 mm²
• Package size: 22 mm × 22 mm

"Pineview" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
• Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB^[5]
• Transistors: 123 million (single-core), 176 million (dual-core)
• Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core)
• Package size: 22 mm × 22 mm

"Cedarview" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
• Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller^[2]
• Package size: 22 × 22 mm

"Silverthorne" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading
• Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
• Model Z515 supports Intel Burst Performance Technology
• Uses the Poulsbo chipset.
• Transistors: 47 million
• Die size: 26 mm²
• Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number)

"Lincroft" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
• GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.^[6]
• Transistors: 140 million
• Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
• Package size: 13.8 mm × 13.8 × 1.0 mm
• Steppings: C0

"Penwell" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Hyper-Threading.
• Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller
• Package size: 12 mm × 12 × 1.0 mm
• Transistors: 140 million
• Die size: 65.2526 mm² (7.34 mm x 8.89 mm)

"Merrifield" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT).
• Z3480 also supports Intel Wireless Display.
• Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
• Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
• Package size: 12 mm × 12 × 1.0 mm

"Moorefield" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, Intel Burst Performance Technology (BPT), Intel Wireless Display.
• GPU (PowerVR G6430) and memory controller are integrated onto the processor die
• Package size: 14 mm × 14 × 1.0 mm

"SoFIA" (28 nm)

• SoFIA (smart or feature phone with Intel architecture)^[7]
• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI (based on Silvermont's specs)
• GPU (ARM Mali) and memory controller are integrated onto the processor die
• Package size: 34 × 40 mm
• SoFIA 3G SoC with Silvermont CPU
  • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130)^[8]
• SoFIA 3G–R SoC with Silvermont CPU
  • Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK)^[8]
• SoFIA LTE (W) with Airmont CPU (Announced, but never launched)
  • Integrated LTE Cat. 4 (XG726-based), SMARTi 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445)^[8]

"Lincroft" (45 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading. All except Z605 support Intel Burst Performance Technology (BPT).
• GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die^[6]
• Transistors: 140 million
• Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
• Package size: 13.8 mm × 13.8 × 1.0 mm
• Steppings: C0

"Cloverview" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), XD bit (an NX bit implementation), Hyper-Threading, Intel Burst Performance Technology (BPT).
• GPU and memory controller are integrated onto the processor die
• Package size: 13.8 mm × 13.8 × 1.0 mm
• Steppings:B1, C0

No official TDP available. For power data see^[9] page 129–130.

"Bay Trail-T" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Burst Performance Technology (BPT), Intel VT-x, AES-NI, TXT/TXE
• Package size: 17 mm × 17 × 1.0 mm

Type 4 SoC:^[10]

• DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
• Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
• Integrated Intel HD Graphics (Gen7) GPU
• One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
• One USB 2.0 controller supporting four ports
• Integrated LPE audio controller
• Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video
• Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
• Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

• DDR3L/L-RS single-channel memory controller supporting up to 2 GB
• Display controller with 1 MIPI DSI port and 2 DDI ports (HDMI 1.4)
• Integrated Intel HD Graphics (Gen7) GPU
• One USB controller supporting two USB 2.0 ports
• Integrated LPE audio controller
• Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
• Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
• Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Cherry Trail-T" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x2 (VT-x with EPT, FlexMigration, FlexPriority and VPID^[11][12] AES-NI.,^[13] TXT/TXE
• Package size: 17 mm × 17 × 1.0 mm

Type 4 SoC:^[10]

• LPDDR3 dual-channel memory controller supporting up to 8 GB
• PCI Express 2.0 controller with 2 lanes
• Display controller with 2 MIPI DSI ports and 3 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
• Integrated Intel HD Graphics (Gen8) GPU
• One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
• One USB xDCI controller supporting one USB 3.0 port
• Integrated LPE audio controller
• Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
• Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
• Serial I/O supporting SPI, UART (serial port), I2C or PWM

Type 3 SoC:

• DDR3L/L-RS single-channel memory controller supporting up to 2 GB
• PCI Express 2.0 controller with 1 lane
• Display controller with 2 MIPI DSI ports and 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4b)
• Integrated Intel HD Graphics (Gen8) GPU
• One USB controller supporting three USB 2.0 ports and two HSIC ports
• Integrated LPE audio controller
• Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
• Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
• Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Tunnel Creek" (45 nm)

• CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), hyper-threading, Intel VT-x.
• Package size: 22 mm × 22 mm
• Steppings: B0
• Temperature range: for (E620, E640, E660, E680): 0 °C to +70 °C, for (E620T, E640T, E660T, E680T): -40 °C to +85 °C.
• DDR2 single-channel memory controller supporting up to 2 GB
• PCI Express 1.0a controller with 4 lanes
• Display controller with LVDS and serial DVO ports
• Integrated GMA600 (PowerVR) GPU
• Integrated HD audio controller
• Serial I/O supporting SPI

"Stellarton" (45 nm)

• "Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA)
• CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x
• Package size: 37.5 mm × 37.5 mm
• Steppings: B0
• TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
• Temperature range: for (E625C, E645C, E665C): 0 °C to +70 °C, for (E625CT, E645CT, E665CT): -40 °C to +85 °C.
• DDR2 single-channel memory controller supporting up to 2 GB
• PCI Express 1.0a controller with 4 lanes
• Display controller with LVDS and serial DVO ports
• Integrated GMA600 (PowerVR) GPU
• Integrated HD audio controller
• Serial I/O supporting SPI

"Bay Trail-I" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, TXT/TXE
• Package size: 25 mm × 27 mm
• DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
• Display controller with 2 DDI ports (eDP 1.3, DP 1.1a, DVI, or HDMI 1.4a)
• Integrated Intel HD Graphics (Gen7) GPU
• PCI Express 2.0 controller with four lanes and four root ports
• Two SATA-300 ports
• One USB 3.0 controller supporting one USB 3.0 port (can be multiplexed to support four USB 2.0 ports)
• One USB 2.0 controller supporting four ports
• Integrated LPE and HD audio controllers
• Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video
• Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
• Serial I/O supporting SPI, UART (serial port), I2C or PWM

"Braswell" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI.
• GPU and memory controller are integrated onto the processor die
• GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows).
• Package size: 25 mm × 27 mm

"Apollo Lake" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
• Package size: 24 mm × 31 mm
• DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
• Display controller with 1 MIPI DSI port and 2 DDI ports (eDP 1.3, DP 1.1a, or HDMI 1.4b)
• Integrated Intel HD Graphics (Gen9) GPU
• PCI Express 2.0 controller supporting 6 lanes (3 dedicated and 3 multiplexed with USB 3.0); 4 lanes available externally
• Two USB 3.0 ports (1 dual role, 1 dedicated, 3 multiplexed with PCI Express 2.0 and 1 multiplexed with one SATA-300 port)
• Two USB 2.0 ports
• Two SATA-600 ports (one multiplexed with USB 3.0)
• Integrated HD audio controller
• Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
• Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
• Serial I/O supporting SPI, HSUART (serial port) and I2C

"Elkhart Lake" (10 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI.
• GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays (4K @ 60 Hz) through HDMI, DP, eDP, or DSI.
• SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
• Package size: 35 mm × 24 mm

"Centerton" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

"Briarwood" (32 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

"Avoton" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64 (according to Datasheet), XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
• Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
• Quad-core SoC peripherals include 4 × USB 2.0, 2 (C2530) or 6 (C2550) × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
• C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
• C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
• Package size: 34 mm × 28 mm
• Die size: 107 mm²

"Rangeley" (22 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
• All models except C2x38 support Intel QuickAssist Technology (cryptography accelerator)
• SoC peripherals include 4 × USB 2.0, 4-6 × SATA (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated GbE LAN (2 for C2316), 2 × UART, and 8-16 lanes of PCI Express 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations.
• Package size: 34 mm × 28 mm

"Denverton" (14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel Turbo Boost (dual-core, C3xx0, C3xx5 only), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, AES-NI, ECC memory.
• SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE (C3538 and up) LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.
• Package size: 34 mm × 28 mm

"Snow Ridge" (10 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
• Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
• SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.
• Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)^[14]
• P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications (extended temperature range).
• Package size: 47.5 mm × 47.5 mm

"Parker Ridge" (10 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit (an NX bit implementation), Intel VT-x, AES-NI, ECC memory.
• SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN (except 51xx model numbers), 3 × UART, and up to 32 lanes of PCI Express (16 × 2.0, 16 × 3.0), in x16, x8, and x4 configurations.
• Intel Dynamic Load Balancer (Intel DLB) & Intel QuickAssist Technology (Intel QAT)^[14]
• Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.
• Package size: 47.5 mm × 47.5 mm

"Sodaville" (45 nm)

^[15]

• Package size: 27 mm × 27 mm
• GPU (based on the PowerVR SGX535 from Imagination Technologies)