Transistor_count

Transistor count

Transistor count

Number of transistors in a device


The transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years.[1] However, being directly proportional to the area of a chip, transistor count does not represent how advanced the corresponding manufacturing technology is: a better indication of this is transistor density (the ratio of a chip's transistor count to its area).

As of 2023, the highest transistor count in flash memory is Micron's 2 terabyte (3D-stacked) 16-die, 232-layer V-NAND flash memory chip, with 5.3 trillion floating-gate MOSFETs (3 bits per transistor).

The highest transistor count in a single chip processor as of 2020 is that of the deep learning processor Wafer Scale Engine 2 by Cerebras. It has 2.6 trillion MOSFETs in 84 exposed fields (dies) on a wafer, manufactured using TSMC's 7 nm FinFET process.[2][3][4][5][6]

As of 2024, the GPU with the highest transistor count is Nvidia's GB200 Grace Blackwell, built on TSMC's 4 nm process and totalling 208 billion MOSFETs.

The highest transistor count in a consumer microprocessor as of June 2023 is 134 billion transistors, in Apple's ARM-based dual-die M2 Ultra system on a chip, which is fabricated using TSMC's 5 nm semiconductor manufacturing process.[7]

More information Year, Component ...

In terms of computer systems that consist of numerous integrated circuits, the supercomputer with the highest transistor count as of 2016 was the Chinese-designed Sunway TaihuLight, which has for all CPUs/nodes combined "about 400 trillion transistors in the processing part of the hardware" and "the DRAM includes about 12 quadrillion transistors, and that's about 97 percent of all the transistors."[8] To compare, the smallest computer, as of 2018 dwarfed by a grain of rice, had on the order of 100,000 transistors. Early experimental solid-state computers had as few as 130 transistors but used large amounts of diode logic. The first carbon nanotube computer had 178 transistors and was a 1-bit one-instruction set computer, while a later one is 16-bit (its instruction set is 32-bit RISC-V though).

Ionic transistor chips ("water-based" analog limited processor), have up to hundreds of such transistors.[9]

Estimates of the total numbers of transistors manufactured:

  • Up to 2014: 2.9×1021
  • Up to 2018: 1.3×1022[10][11]

Transistor count

Plot of MOS transistor counts for microprocessors against dates of in­tro­duction. The curve shows counts doubling every two years, per Moore's law.

Microprocessors

A microprocessor incorporates the functions of a computer's central processing unit on a single integrated circuit. It is a multi-purpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output.

The development of MOS integrated circuit technology in the 1960s led to the development of the first microprocessors.[12] The 20-bit MP944, developed by Garrett AiResearch for the U.S. Navy's F-14 Tomcat fighter in 1970, is considered by its designer Ray Holt to be the first microprocessor.[13] It was a multi-chip microprocessor, fabricated on six MOS chips. However, it was classified by the Navy until 1998. The 4-bit Intel 4004, released in 1971, was the first single-chip microprocessor.

Modern microprocessors typically include on-chip cache memories. The number of transistors used for these cache memories typically far exceeds the number of transistors used to implement the logic of the microprocessor (that is, excluding the cache). For example, the last DEC Alpha chip uses 90% of its transistors for cache.[14]

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GPUs

A graphics processing unit (GPU) is a specialized electronic circuit designed to rapidly manipulate and alter memory to accelerate the building of images in a frame buffer intended for output to a display.

The designer refers to the technology company that designs the logic of the integrated circuit chip (such as Nvidia and AMD). The manufacturer ("Fab.") refers to the semiconductor company that fabricates the chip using its semiconductor manufacturing process at a foundry (such as TSMC and Samsung Semiconductor). The transistor count in a chip is dependent on a manufacturer's fabrication process, with smaller semiconductor nodes typically enabling higher transistor density and thus higher transistor counts.

The random-access memory (RAM) that comes with GPUs (such as VRAM, SGRAM or HBM) greatly increases the total transistor count, with the memory typically accounting for the majority of transistors in a graphics card. For example, Nvidia's Tesla P100 has 15 billion FinFETs (16 nm) in the GPU in addition to 16 GB of HBM2 memory, totaling about 150 billion MOSFETs on the graphics card.[194] The following table does not include the memory. For memory transistor counts, see the Memory section below.

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FPGA

A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a customer or a designer after manufacturing.

More information FPGA, Date of introduction ...

Memory

Semiconductor memory is an electronic data storage device, often used as computer memory, implemented on integrated circuits. Nearly all semiconductor memories since the 1970s have used MOSFETs (MOS transistors), replacing earlier bipolar junction transistors. There are two major types of semiconductor memory: random-access memory (RAM) and non-volatile memory (NVM). In turn, there are two major RAM types: dynamic random-access memory (DRAM) and static random-access memory (SRAM), as well as two major NVM types: flash memory and read-only memory (ROM).

Typical CMOS SRAM consists of six transistors per cell. For DRAM, 1T1C, which means one transistor and one capacitor structure, is common. Capacitor charged or not[clarification needed] is used to store 1 or 0. In flash memory, the data is stored in floating gates, and the resistance of the transistor is sensed[clarification needed] to interpret the data stored. Depending on how fine scale the resistance could be separated[clarification needed], one transistor could store up to three bits, meaning eight distinctive levels of resistance possible per transistor. However, a finer scale comes with the cost of repeatability issues, and hence reliability. Typically, low grade 2-bits MLC flash is used for flash drives, so a 16 GB flash drive contains roughly 64 billion transistors.

For SRAM chips, six-transistor cells (six transistors per bit) was the standard.[295] DRAM chips during the early 1970s had three-transistor cells (three transistors per bit), before single-transistor cells (one transistor per bit) became standard since the era of 4 Kb DRAM in the mid-1970s.[296][297] In single-level flash memory, each cell contains one floating-gate MOSFET (one transistor per bit),[298] whereas multi-level flash contains 2, 3 or 4 bits per transistor.

Flash memory chips are commonly stacked up in layers, up to 128-layer in production,[299] and 136-layer managed,[300] and available in end-user devices up to 69-layer from manufacturers.

More information Chip name, Capacity (bits) ...
More information Chip name, Capacity (bits) ...
More information Chip name, Capacity (bits) ...

Transistor computers

Part of an IBM 7070 card cage populated with Standard Modular System cards

Before transistors were invented, relays were used in commercial tabulating machines and experimental early computers. The world's first working programmable, fully automatic digital computer,[359] the 1941 Z3 22-bit word length computer, had 2,600 relays, and operated at a clock frequency of about 4–5 Hz. The 1940 Complex Number Computer had fewer than 500 relays,[360] but it was not fully programmable. The earliest practical computers used vacuum tubes and solid-state diode logic. ENIAC had 18,000 vacuum tubes, 7,200 crystal diodes, and 1,500 relays, with many of the vacuum tubes containing two triode elements.

The second generation of computers were transistor computers that featured boards filled with discrete transistors, solid-state diodes and magnetic memory cores. The experimental 1953 48-bit Transistor Computer, developed at the University of Manchester, is widely believed to be the first transistor computer to come into operation anywhere in the world (the prototype had 92 point-contact transistors and 550 diodes).[361] A later version the 1955 machine had a total of 250 junction transistors and 1,300 point-contact diodes. The Computer also used a small number of tubes in its clock generator, so it was not the first fully transistorized. The ETL Mark III, developed at the Electrotechnical Laboratory in 1956, may have been the first transistor-based electronic computer using the stored program method. It had about "130 point-contact transistors and about 1,800 germanium diodes were used for logic elements, and these were housed on 300 plug-in packages which could be slipped in and out."[362] The 1958 decimal architecture IBM 7070 was the first transistor computer to be fully programmable. It had about 30,000 alloy-junction germanium transistors and 22,000 germanium diodes, on approximately 14,000 Standard Modular System (SMS) cards. The 1959 MOBIDIC, short for "MOBIle DIgital Computer", at 12,000 pounds (6.0 short tons) mounted in the trailer of a semi-trailer truck, was a transistorized computer for battlefield data.

The third generation of computers used integrated circuits (ICs).[363] The 1962 15-bit Apollo Guidance Computer used "about 4,000 "Type-G" (3-input NOR gate) circuits" for about 12,000 transistors plus 32,000 resistors.[364] The IBM System/360, introduced 1964, used discrete transistors in hybrid circuit packs.[363] The 1965 12-bit PDP-8 CPU had 1409 discrete transistors and over 10,000 diodes, on many cards. Later versions, starting with the 1968 PDP-8/I, used integrated circuits. The PDP-8 was later reimplemented as a microprocessor as the Intersil 6100, see below.[365]

The next generation of computers were the microcomputers, starting with the 1971 Intel 4004, which used MOS transistors. These were used in home computers or personal computers (PCs).

This list includes early transistorized computers (second generation) and IC-based computers (third generation) from the 1950s and 1960s.

More information Computer, Year ...

Logic functions

Transistor count for generic logic functions is based on static CMOS implementation.[384]

More information Function, Ref ...

Parallel systems

Historically, each processing element in earlier parallel systems—like all CPUs of that time—was a serial computer built out of multiple chips. As transistor counts per chip increases, each processing element could be built out of fewer chips, and then later each multi-core processor chip could contain more processing elements.[387]

Goodyear MPP: (1983?) 8 pixel processors per chip, 3,000 to 8,000 transistors per chip.[387]

Brunel University Scape (single-chip array-processing element): (1983) 256 pixel processors per chip, 120,000 to 140,000 transistors per chip.[387]

Cell Broadband Engine: (2006) with 9 cores per chip, had 234 million transistors per chip.[388]

Other devices

More information Device type, Device name ...

Transistor density

The transistor density is the number of transistors that are fabricated per unit area, typically measured in terms of the number of transistors per square millimeter (mm2). The transistor density usually correlates with the gate length of a semiconductor node (also known as a semiconductor manufacturing process), typically measured in nanometers (nm). As of 2019, the semiconductor node with the highest transistor density is TSMC's 5 nanometer node, with 171.3 million transistors per square millimeter (note this corresponds to a transistor-transistor spacing of 76.4 nm, far greater than the relative meaningless "5nm")[395]

MOSFET nodes

More information Node name, 2) ...

See also

Notes

  1. The TMS1000 is a microcontroller, the transistor count includes memory and input/output controllers, not just the CPU.
  2. 3,510 without depletion mode pull-up transistors
  3. 6,813 without depletion mode pull-up transistors
  4. 3,900,000,000 core chiplet die, 2,090,000,000 I/O die
  5. Estimate
  6. Versal Premium are confirmed to be shipping in 1H 2021 but nothing was mentioned about the VP1802 in particular. Usually Xilinx makes separate news for the release of its biggest devices so the VP1802 is likely to be released later.
  7. "Intelligence Processing Unit"

References

  1. Khosla, Robin (2017). Alternate high-k dielectrics for next-generation CMOS logic and memory technology (PhD). IIT Mandi.
  2. Hruska, Joel (August 2019). "Cerebras Systems Unveils 1.2 Trillion Transistor Wafer-Scale Processor for AI". extremetech.com. Retrieved September 6, 2019.
  3. Feldman, Michael (August 2019). "Machine Learning chip breaks new ground with waferscale integration". nextplatform.com. Retrieved September 6, 2019.
  4. Cutress, Ian (August 2019). "Hot Chips 31 Live Blogs: Cerebras' 1.2 Trillion Transistor Deep Learning Processor". anandtech.com. Retrieved September 6, 2019.
  5. "A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip". WikiChip Fuse. November 16, 2019. Retrieved December 2, 2019.
  6. "Apple introduces M2 Ultra" (Press release). Apple. June 5, 2023.
  7. Pires, Francisco (October 5, 2022). "Water-Based Chips Could be Breakthrough for Neural Networking, AI: Wetware has gained an entirely new meaning". Tom's Hardware. Retrieved October 5, 2022.
  8. Handy, Jim (May 26, 2014). "How Many Transistors Have Ever Shipped?". Forbes.
  9. Holt, Ray. "World's First Microprocessor". Retrieved March 5, 2016. 1st fully integrated chip set microprocessor
  10. "Alpha 21364 - Microarchitectures - Compaq - WikiChip". en.wikichip.org. Retrieved September 8, 2019.
  11. Holt, Ray M. (1998). The F14A Central Air Data Computer and the LSI Technology State-of-the-Art in 1968. p. 8.
  12. Holt, Ray M. (2013). "F14 TomCat MOS-LSI Chip Set". First Microprocessor. Archived from the original on November 6, 2020. Retrieved November 6, 2020.
  13. Ryoichi Mori; Hiroaki Tajima; Morihiko Tajima; Yoshikuni Okada (October 1977). "Microprocessors in Japan". Euromicro Newsletter. 3 (4): 50–7. doi:10.1016/0303-1268(77)90111-0.
  14. "NEC 751 (uCOM-4)". The Antique Chip Collector's Page. Archived from the original on May 25, 2011. Retrieved June 11, 2010.
  15. "1970s: Development and evolution of microprocessors" (PDF). Semiconductor History Museum of Japan. Archived from the original (PDF) on June 27, 2019. Retrieved June 27, 2019.
  16. "1973: 12-bit engine-control microprocessor (Toshiba)" (PDF). Semiconductor History Museum of Japan. Archived from the original (PDF) on June 27, 2019. Retrieved June 27, 2019.
  17. "The MOS 6502 and the Best Layout Guy in the World". research.swtch.com. January 3, 2011. Retrieved September 3, 2019.
  18. "Digital History: ZILOG Z8000 (APRIL 1979)". OLD-COMPUTERS.COM : The Museum. Retrieved June 19, 2019.
  19. Microprocessors: 1971 to 1976 Archived December 3, 2013, at the Wayback Machine Christiansen
  20. "Microprocessors 1976 to 1981". weber.edu. Archived from the original on December 3, 2013. Retrieved August 9, 2014.
  21. "W65C816S 16-bit Core". www.westerndesigncenter.com. Retrieved September 12, 2017.
  22. Demone, Paul (November 9, 2000). "ARM's Race to World Domination". real world technologies. Retrieved July 20, 2015.
  23. Hand, Tom. "The Harris RTX 2000 Microcontroller" (PDF). mpeforth.com. Retrieved August 9, 2014.
  24. "Forth chips list". UltraTechnology. March 15, 2001. Retrieved August 9, 2014.
  25. Koopman, Philip J. (1989). "4.4 Architecture of the Novix NC4016". Stack Computers: the new wave. Ellis Horwood Series in Computers and Their Applications. Carnegie Mellon University. ISBN 978-0745804187. Retrieved August 9, 2014.
  26. "Fujitsu SPARC". cpu-collection.de. Retrieved June 30, 2019.
  27. Kimura S, Komoto Y, Yano Y (1988). "Implementation of the V60/V70 and its FRM function". IEEE Micro. 8 (2): 22–36. doi:10.1109/40.527. S2CID 9507994.
  28. "VL2333 - VTI - WikiChip". en.wikichip.org. Retrieved August 31, 2019.
  29. Inayoshi H, Kawasaki I, Nishimukai T, Sakamura K (1988). "Realization of Gmicro/200". IEEE Micro. 8 (2): 12–21. doi:10.1109/40.526. S2CID 36938046.
  30. Bosshart, P.; Hewes, C.; Mi-Chang Chang; Kwok-Kit Chau; Hoac, C.; Houston, T.; Kalyan, V.; Lusky, S.; Mahant-Shetti, S.; Matzke, D.; Ruparel, K.; Ching-Hao Shaw; Sridhar, T.; Stark, D. (October 1987). "A 553K-Transistor LISP Processor Chip". IEEE Journal of Solid-State Circuits. 22 (5): 202–3. doi:10.1109/ISSCC.1987.1157084. S2CID 195841103.
  31. Fahlén, Lennart E.; Stockholm International Peace Research Institute (1987). "3. Hardware requirements for artificial intelligence § Lisp Machines: TI Explorer". Arms and Artificial Intelligence: Weapon and Arms Control Applications of Advanced Computing. SIPRI Monograph Series. Oxford University Press. p. 57. ISBN 978-0-19-829122-0.
  32. Jouppi, Norman P.; Tang, Jeffrey Y. F. (July 1989). "A 20-MIPS Sustained 32-bit CMOS Microprocessor with High Ratio of Sustained to Peak Performance". IEEE Journal of Solid-State Circuits. 24 (5): i. Bibcode:1989IJSSC..24.1348J. CiteSeerX 10.1.1.85.988. doi:10.1109/JSSC.1989.572612. WRL Research Report 89/11.
  33. "The CPU shack museum". CPUshack.com. May 15, 2005. Retrieved August 9, 2014.
  34. "Intel i960 Embedded Microprocessor". National High Magnetic Field Laboratory. Florida State University. March 3, 2003. Archived from the original on March 3, 2003. Retrieved June 29, 2019.
  35. Bakoglu, Grohoski, and Montoye. "The IBM RISC System/6000 processor: Hardware overview." IBM J. Research and Development. Vol. 34 No. 1, January 1990, pp. 12-22.
  36. "SH Microprocessor Leading the Nomadic Era" (PDF). Semiconductor History Museum of Japan. Archived from the original (PDF) on June 27, 2019. Retrieved June 27, 2019.
  37. "SH2: A Low Power RISC Micro for Consumer Applications" (PDF). Hitachi. Archived from the original (PDF) on May 10, 2019. Retrieved June 27, 2019.
  38. "HARP-1: A 120 MHz Superscalar PA-RISC Processor" (PDF). Hitachi. Archived from the original (PDF) on April 23, 2016. Retrieved June 19, 2019.
  39. White and Dhawan. "POWER2: next generation of the RISC System/6000 family" IBM J. Research and Development. Vol. 38 No. 5, September 1994, pp. 493-502.
  40. "ARM7 Statistics". Poppyfields.net. May 27, 1994. Retrieved August 9, 2014.
  41. "Forth Multiprocessor Chip MuP21". www.ultratechnology.com. Retrieved September 6, 2019. MuP21 has a 21-bit CPU core, a memory coprocessor, and a video coprocessor
  42. "F21 CPU". www.ultratechnology.com. Retrieved September 6, 2019. F21 offers video I/O, analog I/O, serial network I/O, and a parallel I/O port on chip. F21 has a transistor count of about 15,000 vs about 7,000 for MuP21.
  43. Gary et al. (1994). "The PowerPC 603 microprocessor: a low-power design for portable applications." Proceedings of COMPCON 94. DOI: 10.1109/CMPCON.1994.282894
  44. Slaton et al. (1995). "The PowerPC 603e microprocessor: an enhanced, low-power, superscalar microprocessor." Proceedings of ICCD '95 International Conference on Computer Design. DOI: 10.1109/ICCD.1995.528810
  45. Bowhill, William J. et al. (1995). "Circuit Implementation of a 300-MHz 64-bit Second-generation CMOS Alpha CPU". Digital Technical Journal, Volume 7, Number 1, pp. 100118.
  46. "Intel Pentium Pro 180". hw-museum.cz. Retrieved September 8, 2019.
  47. "PC Guide Intel Pentium Pro ("P6")". PCGuide.com. April 17, 2001. Archived from the original on April 14, 2001. Retrieved August 9, 2014.
  48. Gaddis, N.; Lotz, J. (November 1996). "A 64-b quad-issue CMOS RISC microprocessor". IEEE Journal of Solid-State Circuits 31 (11): pp. 16971702.
  49. Bouchard, Gregg. "Design objectives of the 0.35 μm Alpha 21164 Microprocessor". IEEE Hot Chips Symposium, August 1996, IEEE Computer Society.
  50. Ulf Samuelsson. "Transistor count of common uCs?". www.embeddedrelated.com. Retrieved September 8, 2019. IIRC, The AVR core is 12,000 gates, and the megaAVR core is 20,000 gates. Each gate is 4 transistors. The chip is considerably larger since the memory uses quite a lot.
  51. Gronowski, Paul E. et al. (May 1998). "High-performance microprocessor design". IEEE Journal of Solid-State Circuits 33 (5): pp. 676686.
  52. Nakagawa, Norio; Arakawa, Fumio (April 1999). "Entertainment Systems and High-Performance Processor SH-4" (PDF). Hitachi Review. 48 (2): 58–63. Retrieved March 18, 2023.
  53. Nishii, O.; Arakawa, F.; Ishibashi, K.; Nakano, S.; Shimura, T.; Suzuki, K.; Tachibana, M.; Totsuka, Y.; Tsunoda, T.; Uchiyama, K.; Yamada, T.; Hattori, T.; Maejima, H.; Nakagawa, N.; Narita, S.; Seki, M.; Shimazaki, Y.; Satomura, R.; Takasuga, T.; Hasegawa, A. (1998). "A 200 MHZ 1.2 W 1.4 GFLOPS microprocessor with graphic operation unit". 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC. First Edition (Cat. No. 98CH36156). IEEE. pp. 18.1-1 - 18.1-11. doi:10.1109/ISSCC.1998.672469. ISBN 0-7803-4344-1. S2CID 45392734. Retrieved March 17, 2023.
  54. Diefendorff, Keith (April 19, 1999). "Sony's Emotionally Charged Chip: Killer Floating-Point "Emotion Engine" To Power PlayStation 2000" (PDF). Microprocessor Report. 13 (5). S2CID 29649747. Archived from the original (PDF) on February 28, 2019. Retrieved June 19, 2019.
  55. Hennessy, John L.; Patterson, David A. (May 29, 2002). Computer Architecture: A Quantitative Approach (3 ed.). Morgan Kaufmann. p. 491. ISBN 978-0-08-050252-6. Retrieved April 9, 2013.
  56. "NVIDIA GeForce 7800 GTX GPU Review". PC Perspective. June 22, 2005. Retrieved June 18, 2019.
  57. Ando, H.; Yoshida, Y.; Inoue, A.; Sugiyama, I.; Asakawa, T.; Morita, K.; Muta, T.; Otokurumada, T.; Okada, S.; Yamashita, H.; Satsukawa, Y.; Konmoto, A.; Yamashita, R.; Sugiyama, H. (2003). "A 1.3GHz fifth generation SPARC64 microprocessor". Proceedings of the 40th Annual Design Automation Conference. Design Automation Conference. pp. 702–705. doi:10.1145/775832.776010. ISBN 1-58113-688-9.
  58. "EE+GS". PS2 Dev Wiki.
  59. "Sony PSX's 90nm CPU is 'not 90nm'". The Register. January 30, 2004.
  60. Fujitsu Limited (August 2004). SPARC64 V Processor For UNIX Server.
  61. "A Glimpse Inside The Cell Processor". Gamasutra. July 13, 2006. Retrieved June 19, 2019.
  62. "Intel Pentium D Processor 920". Intel. Retrieved January 5, 2023.
  63. Toepelt, Bert (January 8, 2009). "AMD Phenom II X4: 45nm Benchmarked — The Phenom II And AMD's Dragon Platform". TomsHardware.com. Retrieved August 9, 2014.
  64. "ARM (Advanced RISC Machines) Processors". EngineersGarage.com. Retrieved August 9, 2014.
  65. "SPARC64 VI Extensions" page 56, Fujitsu Limited, Release 1.3, 27 March 2007
  66. Morgan, Timothy Prickett (17 July 2008). "Fujitsu and Sun Flex Their Quads with New Sparc Server Lineup". The Unix Guardian, Vol. 8, No. 27.
  67. Takumi Maruyama (2009). SPARC64 VIIIfx: Fujitsu's New Generation Octo Core Processor for PETA Scale computing (PDF). Proceedings of Hot Chips 21. IEEE Computer Society. Archived from the original (PDF) on October 8, 2010. Retrieved June 30, 2019.
  68. "Intel Atom N450 specifications". Intel. Retrieved June 8, 2023.
  69. "Intel Atom D510 specifications". Intel. Retrieved June 8, 2023.
  70. Stokes, Jon (February 10, 2010). "Sun's 1 billion-transistor, 16-core Niagara 3 processor". ArsTechnica.com. Retrieved August 9, 2014.
  71. "IBM to Ship World's Fastest Microprocessor". IBM. September 1, 2010. Retrieved August 9, 2014.
  72. "Intel to deliver first computer chip with two billion transistors". AFP. February 5, 2008. Archived from the original on May 20, 2011. Retrieved February 5, 2008.
  73. "Intel Previews Intel Xeon 'Nehalem-EX' Processor." May 26, 2009. Retrieved on May 28, 2009.
  74. Morgan, Timothy Prickett (November 21, 2011), "Fujitsu parades 16-core Sparc64 super stunner", The Register, retrieved December 8, 2011
  75. Angelini, Chris (November 14, 2011). "Intel Core i7-3960X Review: Sandy Bridge-E And X79 Express". TomsHardware.com. Retrieved August 9, 2014.
  76. "Images of SPARC64" (PDF). fujitsu.com. Retrieved August 29, 2017.
  77. "Intel's Atom Architecture: The Journey Begins". AnandTech. Retrieved April 4, 2010.
  78. "Intel Xeon Phi SE10X". TechPowerUp. Retrieved July 20, 2015.
  79. Shimpi, Lal. "The Haswell Review: Intel Core i7-4770K & i5-4670K Tested". anandtech. Retrieved November 20, 2014.
  80. "Dimmick, Frank (August 29, 2014). "Intel Core i7 5960X Extreme Edition Review". Overclockers Club. Retrieved August 29, 2014.
  81. "Apple A8X". NotebookCheck. Retrieved July 20, 2015.
  82. "Intel Readying 15-core Xeon E7 v2". AnandTech. Retrieved August 9, 2014.
  83. "Intel Xeon E5-2600 v3 Processor Overview: Haswell-EP Up to 18 Cores". pcper. September 8, 2014. Retrieved January 29, 2015.
  84. "Intel's Broadwell-U arrives aboard 15W, 28W mobile processors". TechReport. January 5, 2015. Retrieved January 5, 2015.
  85. "Broadwell-E: Intel Core i7-6950X, 6900K, 6850K & 6800K Review". Tom's Hardware. May 30, 2016. Retrieved April 12, 2017.
  86. "The Broadwell-E Review". PC Gamer. July 8, 2016. Retrieved April 12, 2017.
  87. "Broadwell-EP Architecture - Intel Xeon E5-2600 v4 Broadwell-EP Review". Tom's Hardware. March 31, 2016. Retrieved April 4, 2016.
  88. "About the ZipCPU". zipcpu.com. Retrieved September 10, 2019. As of ORCONF, 2016, the ZipCPU used between 1286 and 4926 6-LUTs, depending upon how it is configured.
  89. "Qualcomm Snapdragon 835 (8998)". NotebookCheck. Retrieved September 23, 2017.
  90. Singh, Teja (2017). "3.2 Zen: A Next-Generation High-Performance x86 Core". Proc. IEEE International Solid-State Circuits Conference. pp. 52–54.
  91. Cutress, Ian (February 22, 2017). "AMD Launches Zen". Anandtech.com. Retrieved February 22, 2017.
  92. "Ryzen 5 1600 - AMD". Wikichip.org. April 20, 2018. Retrieved December 9, 2018.
  93. "Kirin 970  HiSilicon". Wikichip. March 1, 2018. Retrieved November 8, 2018.
  94. Leadbetter, Richard (April 6, 2017). "Inside the next Xbox: Project Scorpio tech revealed". Eurogamer. Retrieved May 3, 2017.
  95. "Intel Xeon Platinum 8180". TechPowerUp. December 1, 2018. Retrieved December 2, 2018.
  96. Lee, Y. "SiFive Freedom SoCs : Industry's First Open Source RISC V Chips" (PDF). HotChips 29 IOT/Embedded. Archived from the original (PDF) on August 9, 2020. Retrieved June 19, 2019.
  97. "Documents at Fujitsu" (PDF). fujitsu.com. Retrieved August 29, 2017.
  98. Schmerer, Kai (November 5, 2018). "iPad Pro 2018: A12X-Prozessor bietet deutlich mehr Leistung". ZDNet.de (in German).
  99. "Spotted: Qualcomm Snapdragon 8cx Wafer on 7nm". AnandTech. Retrieved December 6, 2018.
  100. "HiSilicon Kirin 710". Notebookcheck. September 19, 2018. Retrieved November 24, 2018.
  101. Yang, Daniel; Wegner, Stacy (September 21, 2018). "Apple iPhone Xs Max Teardown". TechInsights. Retrieved September 21, 2018.
  102. "Kirin 980  HiSilicon". Wikichip. November 8, 2018. Retrieved November 8, 2018.
  103. "Fujitsu began to produce Japan's billions of super-calculations with the strongest ARM processor A64FX". firstxw.com. April 16, 2019. Archived from the original on June 20, 2019. Retrieved June 19, 2019.
  104. "Hot Chips 30: Nvidia Xavier SoC". fuse.wikichip.org. September 18, 2018. Retrieved December 6, 2018.
  105. Frumusanu, Andrei. "The Samsung Galaxy S10+ Snapdragon & Exynos Review: Almost Perfect, Yet So Flawed". www.anandtech.com. Retrieved February 19, 2021.
  106. "Zen 2 Microarchitecture". WikiChip. Retrieved February 21, 2023.
  107. Frumusanu, Andrei. "The Huawei Mate 30 Pro Review: Top Hardware without Google?". AnandTech. Retrieved January 2, 2020.
  108. Zafar, Ramish (September 10, 2019). "Apple A13 For iPhone 11 Has 8.5 Billion Transistors, Quad-Core GPU". Wccftech. Retrieved September 11, 2019.
  109. "Hot Chips 2020 Live Blog: IBM z15". AnandTech. August 17, 2020.
  110. Broekhuijsen, Niels (October 23, 2019). "AMD's 64-Core EPYC and Ryzen CPUs Stripped: A Detailed Inside Look". Retrieved October 24, 2019.
  111. Friedman, Alan (December 14, 2019). "5nm Kirin 1020 SoC tipped for next year's Huawei Mate 40 line". Phone Arena. Retrieved December 23, 2019.
  112. Verheyde, Arne (December 5, 2019). "Amazon Compares 64-core ARM Graviton2 to Intel's Xeon". Tom's Hardware. Retrieved December 6, 2019.
  113. Morgan, Timothy Prickett (December 3, 2019). "Finally: AWS Gives Servers A Real Shot In The Arm". The Next Platform. Retrieved December 6, 2019.
  114. Friedman, Alan (October 10, 2019). "Qualcomm will reportedly introduce the Snapdragon 865 SoC as soon as next month". Phone Arena. Retrieved February 19, 2021.
  115. "Xiaomi Mi 10 Teardown Analysis | TechInsights". www.techinsights.com. Retrieved February 19, 2021.
  116. "The Linley Group - TI Jacinto Accelerates Level 3 ADAS". www.linleygroup.com. Retrieved February 12, 2021.
  117. "Apple unveils A14 Bionic processor with 40% faster CPU and 11.8 billion transistors". Venturebeat. November 10, 2020. Retrieved November 24, 2020.
  118. "Apple says new Arm-based M1 chip offers the 'longest battery life ever in a Mac'". The Verge. November 10, 2020. Retrieved November 11, 2020.
  119. Ikoba, Jed John (October 23, 2020). "Multiple benchmark tests rank the Kirin 9000 as one of the most-powerful chipset yet". Gizmochina. Retrieved November 14, 2020.
  120. Frumusanu, Andrei. "Huawei Announces Mate 40 Series: Powered by 15.3bn Transistors 5nm Kirin 9000". www.anandtech.com. Retrieved November 14, 2020.
  121. Burd, Thomas (2022). "2.7 Zen3: The AMD 2nd-Generation 7nm x86-64 Microprocessor Core". Proc. IEEE International Solid-State Circuits Conference. pp. 54–56.
  122. "Intel's Core i7-11700K 'Rocket Lake' Delidded: A Big Die, Revealed". tomshardware. March 12, 2021. Retrieved March 16, 2021.
  123. "Intel's 14nm density". www.techcenturion.com. Retrieved November 26, 2019.
  124. "AMD Ryzen 7 5800H Specs". TechPowerUp. Retrieved September 20, 2021.
  125. "Apple iPhone 13 Pro Teardown | TechInsights". www.techinsights.com. Retrieved September 29, 2021.
  126. "Apple Joins 3D-Fabric Portfolio with M1 Ultra?". TechInsights. Retrieved July 8, 2022.
  127. "Hot Chips 2020 live blog". AnandTech. August 17, 2020.
  128. "MediaTek Dimensity 9000". Mediatek. January 21, 2023.
  129. "AMD releases Milan-X CPUs". AnandTech. March 21, 2022.
  130. "Dimensity 9200 specs". Mediatek. November 8, 2022.
  131. "Dimensity 9200 presentation". Mediatek. November 8, 2022.
  132. Goldman, Joshua. "Apple A17 Pro Chip: The New Brain Inside iPhone 15 Pro, Pro Max". CNET. Retrieved September 12, 2023.
  133. "AMD Instinct MI300A Accelerators". AMD. Retrieved January 14, 2024.
  134. Alcorn, Paul (December 6, 2023). "AMD unveils Instinct MI300X GPU and MI300A APU, claims up to 1.6X lead over Nvidia's competing GPUs". Tom's Hardware. Retrieved January 14, 2024.
  135. Williams, Chris. "Nvidia's Tesla P100 has 15 billion transistors, 21TFLOPS". www.theregister.co.uk. Retrieved August 12, 2019.
  136. MOS Technology Agnus. ISBN 5511916846.
  137. "30 Years of Console Gaming". Klinger Photography. August 20, 2017. Retrieved June 19, 2019.
  138. "Diamond Edge 3D (nVidia NV1+Sega Saturn)". Naver. February 24, 2017. Retrieved June 19, 2019.
  139. "Sega Saturn". MAME. Retrieved July 18, 2019.
  140. "ASIC CHIPS ARE INDUSTRY'S GAME WINNERS". The Washington Post. September 18, 1995. Retrieved June 19, 2019.
  141. "Is it Time to Rename the GPU?". Jon Peddie Research. IEEE Computer Society. July 9, 2018. Retrieved June 19, 2019.
  142. "Reality Co-Processor − The Power In Nintendo64" (PDF). Silicon Graphics. August 26, 1997. Archived from the original (PDF) on May 19, 2020. Retrieved June 18, 2019.
  143. "Imagination PowerVR PCX2 GPU". VideoCardz.net. Retrieved June 19, 2019.
  144. Lilly, Paul (May 19, 2009). "From Voodoo to GeForce: The Awesome History of 3D Graphics". PC Gamer. Retrieved June 19, 2019.
  145. "3D accelerator database". Vintage 3D. Retrieved July 21, 2019.
  146. Singer, Graham (April 3, 2013). "History of the Modern Graphics Processor, Part 2". TechSpot. Retrieved July 21, 2019.
  147. "Remembering the Sega Dreamcast". Bit-Tech. September 29, 2009. Retrieved June 18, 2019.
  148. Weinberg, Neil (September 7, 1998). "Comeback kid". Forbes. Retrieved June 19, 2019.
  149. Charles, Bertie (1998). "Sega's New Dimension". Forbes. 162 (5–9). Forbes Incorporated: 206. The chip, etched in 0.25-micron detail — state-of-the-art for graphics processors — fits 10 million transistors
  150. Hagiwara, Shiro; Oliver, Ian (November–December 1999). "Sega Dreamcast: Creating a Unified Entertainment World". IEEE Micro. 19 (6). IEEE Computer Society: 29–35. doi:10.1109/40.809375. Archived from the original on August 23, 2000. Retrieved June 27, 2019.
  151. "VideoLogic Neon 250 4MB". VideoCardz.net. Retrieved June 19, 2019.
  152. Shimpi, Anand Lal (November 21, 1998). "Fall Comdex '98 Coverage". AnandTech. Retrieved June 19, 2019.
  153. "NVIDIA NV10 A3 GPU Specs". TechPowerUp. Retrieved June 19, 2019.
  154. IGN Staff (November 4, 2000). "Gamecube Versus PlayStation 2". IGN. Retrieved November 22, 2015.
  155. "NVIDIA NV2A GPU Specs". TechPowerUp. Retrieved July 21, 2019.
  156. "ATI Xenos GPU Specs". TechPowerUp. Retrieved June 21, 2019.
  157. International, GamesIndustry (July 14, 2005). "TSMC to manufacture X360 GPU". Eurogamer. Retrieved August 22, 2006.
  158. "NVIDIA Playstation 3 RSX 65nm Specs". TechPowerUp. Retrieved June 21, 2019.
  159. "PS3 Graphics Chip Goes 65nm in Fall". Edge Online. June 26, 2008. Archived from the original on July 25, 2008.
  160. "The Radeon HD 4850 & 4870: AMD Wins at $199 and $299". AnandTech.com. Retrieved August 9, 2014.
  161. Glaskowsky, Peter. "ATI and Nvidia face off-obliquely". CNET. Archived from the original on January 27, 2012. Retrieved August 9, 2014.
  162. Woligroski, Don (December 22, 2011). "AMD Radeon HD 7970". TomsHardware.com. Retrieved August 9, 2014.
  163. "NVIDIA Kepler GK110 Architecture" (PDF). NVIDIA. 2012. Retrieved January 9, 2024.
  164. "Whitepaper: NVIDIA GeForce GTX 680" (PDF). NVIDIA. 2012. Archived from the original (PDF) on April 17, 2012.
  165. Kan, Michael (August 18, 2020). "Xbox Series X May Give Your Wallet a Workout Due to High Chip Manufacturing Costs". PCMag. Retrieved September 5, 2020.
  166. "AMD Xbox One GPU". www.techpowerup.com. Retrieved February 5, 2020.
  167. "AMD PlayStation 4 GPU". www.techpowerup.com. Retrieved February 5, 2020.
  168. "AMD Xbox One S GPU". www.techpowerup.com. Retrieved February 5, 2020.
  169. "AMD PlayStation 4 Pro GPU". www.techpowerup.com. Retrieved February 5, 2020.
  170. Smith, Ryan (June 29, 2016). "The AMD RX 480 Preview". Anandtech.com. Retrieved February 22, 2017.
  171. Schor, David (July 22, 2018). "VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP". WikiChip Fuse. Retrieved May 31, 2019.
  172. Harris, Mark (April 5, 2016). "Inside Pascal: NVIDIA's Newest Computing Platform". Nvidia developer blog.
  173. "GPU Database: Pascal". TechPowerUp. July 26, 2023.
  174. "AMD Xbox One X GPU". www.techpowerup.com. Retrieved February 5, 2020.
  175. Durant, Luke; Giroux, Olivier; Harris, Mark; Stam, Nick (May 10, 2017). "Inside Volta: The World's Most Advanced Data Center GPU". Nvidia developer blog.
  176. "NVIDIA GeForce GTX 1650". www.techpowerup.com. Retrieved February 5, 2020.
  177. "NVIDIA GeForce GTX 1660 Ti". www.techpowerup.com. Retrieved February 5, 2020.
  178. "AMD Radeon RX 5700 XT". www.techpowerup.com. Retrieved February 5, 2020.
  179. "AMD Radeon RX 5500 XT". www.techpowerup.com. Retrieved February 5, 2020.
  180. "AMD Arcturus GPU Specs". TechPowerUp. Retrieved November 10, 2022.
  181. "Nvidia Ampere Architecture". www.nvidia.com. Retrieved May 15, 2020.
  182. "NVIDIA GA102 GPU Specs". Techpowerup. Retrieved September 5, 2020.
  183. "'Giant Step into the Future': NVIDIA CEO Unveils GeForce RTX 30 Series GPUs". www.nvidia.com. September 2020. Retrieved September 5, 2020.
  184. "NVIDIA GA103 GPU Specs". TechPowerUp. Retrieved March 21, 2023.
  185. "NVIDIA GeForce RTX 3070 Specs". TechPowerUp. Retrieved September 20, 2021.
  186. "NVIDIA GA106 specs". TechPowerUp. Retrieved March 22, 2023.
  187. "NVIDIA GA107 GPU Specs". TechPowerUp. Retrieved March 21, 2023.
  188. "MI250X die size estimates". Twitter. November 17, 2021.
  189. "Nvidia Launches Hopper H100 GPU, New DGXs and Grace Superchips". HPCWire. March 22, 2022. Retrieved March 23, 2022.
  190. "AMD Navi 31 GPU Specs". TechPowerUp. Retrieved November 7, 2023.
  191. "AMD Navi 32 GPU Specs". TechPowerUp. Retrieved November 7, 2023.
  192. "AMD Navi 33 GPU Specs". TechPowerUp. Retrieved March 21, 2023.
  193. "AMD Has a GPU to Rival Nvidia's H100". HPCWire. June 13, 2023. Retrieved June 14, 2023.
  194. "AMD Aqua Vanjaram Specs". TechPowerUp. Retrieved January 14, 2024.
  195. "Taiwan Company UMC Delivers 65nm FPGAs to Xilinx." SDA-ASIA Thursday, November 9, 2006.
  196. ""Altera's new 40nm FPGAs — 2.5 billion transistors!". pldesignline.com. Archived from the original on June 19, 2010. Retrieved January 22, 2009.
  197. "Altera unveils 28-nm Stratix V FPGA family". April 20, 2010. Retrieved April 20, 2010.
  198. "Design of a High-Density SoC FPGA at 20nm" (PDF). 2014. Archived from the original (PDF) on April 23, 2016. Retrieved July 16, 2017.
  199. Maxfield, Clive (October 2011). "New Xilinx Virtex-7 2000T FPGA provides equivalent of 20 million ASIC gates". EETimes. AspenCore. Retrieved September 4, 2019.
  200. Greenhill, D.; Ho, R.; Lewis, D.; Schmit, H.; Chan, K. H.; Tong, A.; Atsatt, S.; How, D.; McElheny, P. (February 2017). "3.3 a 14nm 1GHz FPGA with 2.5D transceiver integration". 2017 IEEE International Solid-State Circuits Conference (ISSCC). pp. 54–55. doi:10.1109/ISSCC.2017.7870257. ISBN 978-1-5090-3758-2. S2CID 2135354.
  201. "3.3 A 14nm 1GHz FPGA with 2.5D transceiver integration | DeepDyve". May 17, 2017. Archived from the original on May 17, 2017. Retrieved September 19, 2019.
  202. Santarini, Mike (May 2014). "Xilinx Ships Industry's First 20-nm All Programmable Devices" (PDF). Xcell journal. No. 86. Xilinx. p. 14. Retrieved June 3, 2014.
  203. Sims, Tara (August 2019). "Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells". www.xilinx.com. Retrieved August 22, 2019.
  204. Verheyde, Arne (August 2019). "Xilinx Introduces World's Largest FPGA With 35 Billion Transistors". www.tomshardware.com. Retrieved August 23, 2019.
  205. Cutress, Ian (August 2019). "Xilinx Announces World Largest FPGA: Virtex Ultrascale+ VU19P with 9m Cells". www.anandtech.com. Retrieved September 25, 2019.
  206. Abazovic, Fuad (May 2019). "Xilinx 7nm Versal taped out last year". Retrieved September 30, 2019.
  207. Cutress, Ian (August 2019). "Hot Chips 31 Live Blogs: Xilinx Versal AI Engine". Retrieved September 30, 2019.
  208. Krewell, Kevin (August 2019). "Hot Chips 2019 highlights new AI strategies". Retrieved September 30, 2019.
  209. Verheyde, Arne (November 6, 2019). "Intel Introduces World's Largest FPGA With 43.3 Billion Transistors". Retrieved November 7, 2019.
  210. Cutress, Ian (August 2020). "Hot Chips 2020 Live Blog: Xilinx Versal ACAPs". Retrieved September 9, 2020.
  211. "Late 1960s: Beginnings of MOS memory" (PDF). Semiconductor History Museum of Japan. January 23, 2019. Retrieved June 27, 2019.
  212. "2.1.1 Flash Memory". TU Wien. Retrieved June 20, 2019.
  213. Shilov, Anton. "SK Hynix Starts Production of 128-Layer 4D NAND, 176-Layer Being Developed". www.anandtech.com. Retrieved September 16, 2019.
  214. "Samsung Begins Production of 100+ Layer Sixth-Generation V-NAND Flash". PC Perspective. August 11, 2019. Retrieved September 16, 2019.
  215. "Specifications for Toshiba "TOSCAL" BC-1411". Old Calculator Web Museum. Archived from the original on July 3, 2017. Retrieved May 8, 2018.
  216. "Toshiba "Toscal" BC-1411 Desktop Calculator". Old Calculator Web Museum. Archived from the original on May 20, 2007.
  217. IBM first in IC memory. IBM Corporation. 1965. Retrieved June 19, 2019. {{cite book}}: |website= ignored (help)
  218. "A chronological list of Intel products. The products are sorted by date" (PDF). Intel museum. Intel Corporation. July 2005. Archived from the original (PDF) on August 9, 2007. Retrieved July 31, 2007.
  219. "1970s: SRAM evolution" (PDF). Semiconductor History Museum of Japan. Retrieved June 27, 2019.
  220. "Intel: 35 Years of Innovation (1968–2003)" (PDF). Intel. 2003. Archived from the original (PDF) on November 4, 2021. Retrieved June 26, 2019.
  221. Lojek, Bo (2007). History of Semiconductor Engineering. Springer Science & Business Media. pp. 362–363. ISBN 9783540342588. The i1103 was manufactured on a 6-mask silicon-gate P-MOS process with 8 μm minimum features. The resulting product had a 2,400 μm2 memory cell size, a die size just under 10 mm2, and sold for around $21.
  222. "Manufacturers in Japan enter the DRAM market and integration densities are improved" (PDF). Semiconductor History Museum of Japan. Retrieved June 27, 2019.
  223. Gealow, Jeffrey Carl (August 10, 1990). "Impact of Processing Technology on DRAM Sense Amplifier Design" (PDF). Massachusetts Institute of Technology. pp. 149–166. Retrieved June 25, 2019 via CORE.
  224. "Silicon Gate MOS 2102A". Intel. Retrieved June 27, 2019.
  225. Component Data Catalog (PDF). Intel. 1978. pp. 3–94. Retrieved June 27, 2019.
  226. "Memory". STOL (Semiconductor Technology Online). Archived from the original on November 2, 2023. Retrieved June 25, 2019.
  227. "Computer History for 1984". Computer Hope. Retrieved June 25, 2019.
  228. "Japanese Technical Abstracts". Japanese Technical Abstracts. 2 (3–4). University Microfilms: 161. 1987. The announcement of 1M DRAM in 1984 began the era of megabytes.
  229. "KM48SL2000-7 Datasheet". Samsung. August 1992. Retrieved June 19, 2019.
  230. "Electronic Design". Electronic Design. 41 (15–21). Hayden Publishing Company. 1993. The first commercial synchronous DRAM, the Samsung 16-Mbit KM48SL2000, employs a single-bank architecture that lets system designers easily transition from asynchronous to synchronous systems.
  231. Breaking the gigabit barrier, DRAMs at ISSCC portend major system-design impact. (dynamic random access memory; International Solid-State Circuits Conference; Hitachi Ltd. and NEC Corp. research and development), January 9, 1995
  232. "Japanese Company Profiles" (PDF). Smithsonian Institution. 1996. Retrieved June 27, 2019.
  233. "History: 1990s". SK Hynix. Archived from the original on February 5, 2021. Retrieved July 6, 2019.
  234. "Samsung 50nm 2GB DDR3 chips are industry's smallest". SlashGear. September 29, 2008. Retrieved June 25, 2019.
  235. "Samsung Unleashes a Roomy DDR4 256GB RAM". Tom's Hardware. September 6, 2018. Archived from the original on June 21, 2019. Retrieved June 21, 2019.
  236. "First 3D Nanotube and RRAM ICs Come Out of Foundry". IEEE Spectrum: Technology, Engineering, and Science News. July 19, 2019. Retrieved September 16, 2019. This wafer was made just last Friday... and it's the first monolithic 3D IC ever fabricated within a foundry
  237. "Three Dimensional Monolithic System-on-a-Chip". www.darpa.mil. Retrieved September 16, 2019.
  238. "DD28F032SA Datasheet". Intel. Retrieved June 27, 2019.
  239. "TOSHIBA ANNOUNCES 1 GIGABYTE COMPACTFLASH CARD". Toshiba. September 9, 2002. Archived from the original on March 11, 2006. Retrieved March 11, 2006.
  240. "History". Samsung Electronics. Samsung. Retrieved June 19, 2019.
  241. "Samsung e·MMC Product family" (PDF). Samsung Electronics. December 2011. Archived from the original (PDF) on November 8, 2019. Retrieved July 15, 2019.
  242. Manners, David (January 30, 2019). "Samsung makes 1TB flash eUFS module". Electronics Weekly. Retrieved June 23, 2019.
  243. Tallis, Billy (October 17, 2018). "Samsung Shares SSD Roadmap for QLC NAND And 96-layer 3D NAND". AnandTech. Retrieved June 27, 2019.
  244. "232-Layer NAND". Micron. Retrieved October 17, 2022.
  245. Han-Way Huang (December 5, 2008). Embedded System Design with C805. Cengage Learning. p. 22. ISBN 978-1-111-81079-5. Archived from the original on April 27, 2018.
  246. Marie-Aude Aufaure; Esteban Zimányi (January 17, 2013). Business Intelligence: Second European Summer School, eBISS 2012, Brussels, Belgium, July 15-21, 2012, Tutorial Lectures. Springer. p. 136. ISBN 978-3-642-36318-4. Archived from the original on April 27, 2018.
  247. Iizuka, H.; Masuoka, F.; Sato, Tai; Ishikawa, M. (1976). "Electrically alterable avalanche-injection-type MOS READ-ONLY memory with stacked-gate structure". IEEE Transactions on Electron Devices. 23 (4): 379–387. Bibcode:1976ITED...23..379I. doi:10.1109/T-ED.1976.18415. ISSN 0018-9383. S2CID 30491074.
  248. μCOM-43 SINGLE CHIP MICROCOMPUTER: USERS' MANUAL (PDF). NEC Microcomputers. January 1978. Retrieved June 27, 2019.
  249. "2716: 16K (2K x 8) UV ERASABLE PROM" (PDF). Intel. Archived from the original (PDF) on September 13, 2020. Retrieved June 27, 2019.
  250. "1982 CATALOG" (PDF). NEC Electronics. Retrieved June 20, 2019.
  251. Component Data Catalog (PDF). Intel. 1978. pp. 1–3. Retrieved June 27, 2019.
  252. "27256 Datasheet" (PDF). Intel. Retrieved July 2, 2019.
  253. "D27512-30 Datasheet" (PDF). Intel. Retrieved July 2, 2019.
  254. "A Computer Pioneer Rediscovered, 50 Years On". The New York Times. April 20, 1994. Archived from the original on November 4, 2016.
  255. "History of Computers and Computing, Birth of the modern computer, Relays computer, George Stibitz". history-computer.com. Retrieved August 22, 2019. Initially the 'Complex Number Computer' performed only complex multiplication and division, but later a simple modification enabled it to add and subtract as well. It used about 400-450 binary relays, 6-8 panels, and ten multiposition, multipole relays called "crossbars" for temporary storage of numbers.
  256. "Brief History". IPSJ Computer Museum. Information Processing Society of Japan. Retrieved June 19, 2019.
  257. "PDP-8 (Straight 8) Computer Functional Restoration". www.pdp8.net. Retrieved August 22, 2019. backplanes contain 230 cards, approximately 10,148 diodes, 1409 transistors, 5615 resistors, and 1674 capacitors
  258. "IBM 608 calculator". IBM. January 23, 2003. Retrieved March 8, 2021.
  259. "【NEC】 NEAC-2201". IPSJ Computer Museum. Information Processing Society of Japan. Retrieved June 19, 2019.
  260. "【NEC】 NEAC-2203". IPSJ Computer Museum. Information Processing Society of Japan. Retrieved June 19, 2019.
  261. "【Toshiba】 TOSBAC-2100". IPSJ Computer Museum. Information Processing Society of Japan. Retrieved June 19, 2019.
  262. Erich Bloch (1959). The Engineering Design of the Stretch Computer (PDF). Eastern Joint Computer Conference.
  263. "【NEC】NEAC-L2". IPSJ Computer Museum. Information Processing Society of Japan. Retrieved June 19, 2019.
  264. Thornton, James (1970). Design of a Computer: the Control Data 6600. p. 20.
  265. Jan M. Rabaey, Digital Integrated Circuits, Fall 2001: Course Notes, Chapter 6: Designing Combinatorial Logic Gates in CMOS, retrieved October 27, 2012.
  266. Richard F. Tinder (January 2000). Engineering Digital Design. Academic Press. ISBN 978-0-12-691295-1.
  267. Engineers, Institute of Electrical Electronics (2000). 100-2000 (7th ed.). doi:10.1109/IEEESTD.2000.322230. ISBN 978-0-7381-2601-2. IEEE Std 100-2000.
  268. Smith, Kevin (August 11, 1983). "Image processor handles 256 pixels simultaneously". Electronics.
  269. Kanellos, Michael (February 9, 2005). "Cell chip: Hit or hype?". CNET News. Archived from the original on October 25, 2012.
  270. Kennedy, Patrick (June 2019). "Hands-on With a Graphcore C2 IPU PCIe Card at Dell Tech World". servethehome.com. Retrieved December 29, 2019.
  271. "Colossus  Graphcore". en.wikichip.org. Retrieved December 29, 2019.
  272. Graphcore. "IPU Technology". www.graphcore.ai.
  273. "NVIDIA NVLink4 NVSwitch at Hot Chips 34". ServeTheHome. August 22, 2022.
  274. Schor, David (April 6, 2019). "TSMC Starts 5-Nanometer Risk Production". WikiChip Fuse. Retrieved April 7, 2019.
  275. Lojek, Bo (2007). History of Semiconductor Engineering. Springer Science & Business Media. pp. 321–3. ISBN 9783540342588.
  276. Lambrechts, Wynand; Sinha, Saurabh; Abdallah, Jassem Ahmed; Prinsloo, Jaco (2018). Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques. CRC Press. p. 59. ISBN 9781351248655.
  277. "1978: Double-well fast CMOS SRAM (Hitachi)" (PDF). Semiconductor History Museum of Japan. Retrieved July 5, 2019.
  278. "0.18-micron Technology". TSMC. Retrieved June 30, 2019.
  279. Diefendorff, Keith (15 November 1999). "Hal Makes Sparcs Fly". Microprocessor Report, Volume 13, Number 5.
  280. Williams, Martyn (July 12, 2004). "Fujitsu, Toshiba begin 65nm chip trial production". InfoWorld. Retrieved June 26, 2019.
  281. Elpida's presentation at Via Technology Forum 2005 and Elpida 2005 Annual Report
  282. "Intel Now Packs 100 Million Transistors in Each Square Millimeter". IEEE Spectrum: Technology, Engineering, and Science News. March 30, 2017. Retrieved November 14, 2018.
  283. "40nm Technology". TSMC. Retrieved June 30, 2019.
  284. "History: 2010s". SK Hynix. Archived from the original on April 29, 2021. Retrieved July 8, 2019.
  285. Shimpi, Anand Lal (June 8, 2012). "SandForce Demos 19nm Toshiba & 20nm IMFT NAND Flash". AnandTech. Retrieved June 19, 2019.
  286. Schor, David (April 16, 2019). "TSMC Announces 6-Nanometer Process". WikiChip Fuse. Retrieved May 31, 2019.
  287. "16/12nm Technology". TSMC. Retrieved June 30, 2019.
  288. "VLSI 2018: Samsung's 8nm 8LPP, a 10nm extension". WikiChip Fuse. July 1, 2018. Retrieved May 31, 2019.
  289. "Samsung Mass Producing 128Gb 3-bit MLC NAND Flash". Tom's Hardware. April 11, 2013. Archived from the original on June 21, 2019. Retrieved June 21, 2019.
  290. "10nm Technology". TSMC. Retrieved June 30, 2019.
  291. Jones, Scotten (May 3, 2019). "TSMC and Samsung 5nm Comparison". Semiwiki. Retrieved July 30, 2019.
  292. Nenni, Daniel (January 2, 2019). "Samsung vs TSMC 7nm Update". Semiwiki. Retrieved July 6, 2019.
  293. "7nm Technology". TSMC. Retrieved June 30, 2019.
  294. Schor, David (June 15, 2018). "A Look at Intel's 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium". WikiChip Fuse. Retrieved May 31, 2019.
  295. "Samsung Foundry update 2019". SemiWiki. August 6, 2019.
  296. Armasu, Lucian (January 11, 2019), "Samsung Plans Mass Production of 3nm GAAFET Chips in 2021", www.tomshardware.com
  297. "TSMC Plans New Fab for 3nm". EE Times. December 12, 2016. Retrieved September 26, 2019.
  298. "The Future Is Now (blog post)". TSMC. December 16, 2021.
  299. "TSMC Unveils N4X Node". AnandTech. December 17, 2021.
  300. "TSMC roadmap update". AnandTech. April 22, 2022.
  301. Alcorn, Paul (March 24, 2021). "Intel Fixes 7nm, Meteor Lake and Granite Rapids Coming in 2023". Tom's Hardware. Retrieved June 1, 2021.
  302. Cutress, Dr Ian. "Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!". www.anandtech.com. Retrieved July 27, 2021.

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