Tetramethyl_bisphenol_F
Tetramethyl bisphenol F
Chemical compound
Tetramethyl bisphenol F (TMBPF) is a new coating intended as a safer replacement for bisphenol A and bisphenol F to use in epoxy linings of aluminium cans and steel cans. It was previously suggested as an insulator in electronic circuit boards.[1]
Polymerisation of tetramethyl bisphenol F occurs with epichlorohydrin when heated between 40 and 70 °C using an alkali as a catalyst to form the resin used as a coating.