IEEE_Rao_R._Tummala_Electronics_Packaging_Award

IEEE Rao R. Tummala Electronics Packaging Award

IEEE Rao R. Tummala Electronics Packaging Award

Annual award for contributions to electronic component manufacturing

The IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients

Recipients of the award for each year include:

References

  1. [1]
    Mauro J. Walker, Driver of Microelectronics Production Advancements, to Receive 2012 IEEE Components, Packaging and Manufacturing Technology Award, IEEE Press release Archived 2014-05-02 at the Wayback Machine
  2. [2]
    Rao Tummala to Receive IEEE CPMT Award, Georgia Inst. Technology, July 23, 2010. Archived March 31, 2012, at the Wayback Machine
  3. [3]
    Rao R. Tummala, Microelectronics Packaging Trailblazer, to Receive 2011 IEEE Components Packaging and Manufacturing Technology Award, TMCnet.com, May 19, 2011.
  4. [4]
    IEEE Components, Packaging & Manufacturing Technology Award 2010, Fraunhofer IZM, July 2009.
  5. [5]
    Herbert Reichl awarded IEEE CPMT field award for 2010, ElectroIQ, June 10, 2010.
  6. [6]
    Harman Receives IEEE Award for Wire Bonding Improvements, ElectroIQ, May 13, 2009.
  7. [7]
    C. P. Wong, Regent's Professor, Georgia Inst. Technology Archived 2011-10-25 at the Wayback Machine


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