List_of_AMD_Ryzen_processors

List of AMD Ryzen processors

List of AMD Ryzen processors

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The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.

Desktop processors

Ryzen 1000 series

Summit Ridge (1000 series, Zen based)

Common features of Ryzen 1000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2666 in dual-channel mode.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Node/fabrication process: GlobalFoundries 14 LP.
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCX) × cores per CCX

Whitehaven (Threadripper 1000 series, Zen based)

Common features of Ryzen 1000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2666 in quad-channel mode.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Node/fabrication process: GlobalFoundries 14LP.
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCX) × cores per CCX
  2. Processor package actually contains two additional inactive dies to provide structural support to the integrated heat spreader.

Ryzen 2000 series

Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)

Common features of Ryzen 2000 desktop APUs:

More information Branding and Model, CPU ...
  1. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version; 2200GE, 2200G, 2400GE, 2400G, released on May 14, 2018 for OEM only.[lower-alpha 2]
  2. "World's Largest Commercial PC Manufacturers Introduce AMD Ryzen PRO Mobile and Desktop APU Powered Systems". AMD (Press release). May 14, 2018. Retrieved April 8, 2023.

Pinnacle Ridge (2000 series, Zen+ based)

Common features of Ryzen 2000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E and R5 2600E which support it at DDR4-2666 speeds.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCX) × cores per CCX
  1. Model also available as PRO version as 2600[4], 2700[5], 2700X[6], released on September 19, 2018.
  2. AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200[lower-alpha 3] and 1600[lower-alpha 4] with "AF" suffixes).
  3. "AMD Ryzen 3 1200". AMD. Retrieved October 9, 2022.
  4. "AMD Ryzen 5 1600". AMD. Retrieved October 9, 2022.

Colfax (Threadripper 2000 series, Zen+ based)

Common features of Ryzen 2000 HEDT CPUs:

  • Socket: TR4.
  • All the CPUs support DDR4-2933 in quad-channel mode.
  • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: GlobalFoundries 12LP (14LP+).
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCX) × cores per CCX

Ryzen 3000 series

Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)

Common features of Ryzen 3000 desktop APUs:

More information Branding and Model, CPU ...
  1. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Matisse (3000 series, Zen 2 based)

Common features of Ryzen 3000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCXs) × cores per CCX
  2. Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[13]
  3. Ryzen 7 3700X may consume 90 W under load.[14]
  1. Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs.

Castle Peak (Threadripper 3000 series, Zen 2 based)

Common features of Ryzen 3000 HEDT/workstation CPUs:

  • Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
  • Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
More information Branding and Model, Cores (threads) ...
  1. Core Complexes (CCXs) × cores per CCX
  2. Ryzen Threadripper 3990X may consume over 490 W under load.[17]

Ryzen 4000 series

Renoir (4000 series, Zen 2 based)

Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:

  • Socket: AM4.
  • All the CPUs support DDR4-3200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
  • No integrated graphics.
  • Fabrication process: TSMC 7FF.
  • Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.[18][19][20]

More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX

    Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)

    Common features of Ryzen 4000 desktop APUs:

    • Socket: AM4.
    • All the CPUs support DDR4-3200 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • Includes integrated GCN 5th generation GPU.
    • Fabrication process: TSMC 7FF.
    More information Branding and model, CPU ...
    1. Core complexes (CCXs) × cores per CCX
    2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. Model also available as PRO version as 4350GE,[lower-alpha 3] 4350G,[lower-alpha 4] 4650GE,[lower-alpha 5] 4650G,[lower-alpha 6] 4750GE,[lower-alpha 7] 4750G,[lower-alpha 8] released on July 21, 2020 for OEM only.[lower-alpha 9]
    2. All of the iGPUs are branded as AMD Radeon Graphics.
    3. "AMD Ryzen 3 PRO 4350GE". AMD. Retrieved October 18, 2022.
    4. "AMD Ryzen 3 PRO 4350G". AMD. Retrieved October 18, 2022.
    5. "AMD Ryzen 3 PRO 4650GE". AMD. Retrieved October 18, 2022.
    6. "AMD Ryzen 3 PRO 4650G". AMD. Retrieved October 18, 2022.
    7. "AMD Ryzen 3 PRO 4750GE". AMD. Retrieved October 18, 2022.
    8. "AMD Ryzen 3 PRO 4750G". AMD. Retrieved October 18, 2022.

    Ryzen 5000 series

    Vermeer (5000 series, Zen 3 based)

    Common features of Ryzen 5000 desktop CPUs:

    • Socket: AM4.
    • All the CPUs support DDR4-3200 in dual-channel mode.
    • L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
    • L2 cache: 512 KB per core.
    • All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • No integrated graphics.
    • Fabrication process: TSMC 7FF.
    More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX

    Cezanne (5000 series, Zen 3 based)

    Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:

    • Socket: AM4.
    • CPUs support DDR4-3200 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • No integrated graphics.
    • Fabrication process: TSMC 7FF.
    More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX

    Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)

    Common features of Ryzen 5000 desktop APUs:

    • Socket: AM4.
    • All the CPUs support DDR4-3200 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • Includes integrated GCN 5th generation GPU.
    • Fabrication process: TSMC 7FF.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. All of the iGPUs are branded as AMD Radeon Graphics.
    2. Model also available as PRO version as 5350GE,[lower-alpha 3] 5350G,[lower-alpha 4] 5650GE,[lower-alpha 5] 5650G,[lower-alpha 6] 5750GE,[lower-alpha 7] 5750G,[lower-alpha 8] released June 1, 2021.[lower-alpha 9]

    Chagall (Threadripper 5000 series, Zen 3 based)

    Common features of Ryzen 5000 workstation CPUs:

    • Socket: sWRX8.
    • All the CPUs support DDR4-3200 in octa-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
    • No integrated graphics.
    • Fabrication process: TSMC 7FF.
    More information Branding and Model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX

    Ryzen 7000 series

    Raphael (7000 series, Zen 4/RDNA2 based)

    Common features of Ryzen 7000 desktop CPUs:

    • Socket: AM5.
    • All the CPUs support DDR5-5200 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[lower-roman 1]. Models with "F" suffixes are without iGPUs.
    • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
    More information Branding and model, Cores (threads) ...
    1. Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs).
    2. Core Complexes (CCX) × cores per CCX
    3. Only one of the two CCXes has additional 64 MB 3D V-Cache.[31] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[32]

    Storm Peak (Threadripper 7000 series, Zen 4 based)

    Common features of Ryzen 7000 HEDT/workstation CPUs:

    • Socket: sTR5.
    • Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
    • No integrated graphics.
    • Fabrication process: TSMC 5FF.
    More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCXs) × cores per CCX

    Ryzen 8000 series

    Phoenix (8000 series, Zen 4 based)

    Common features of Ryzen 8000 desktop CPUs:

    • Socket: AM5.
    • All the CPUs support DDR5-5200 RAM in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
    • No integrated graphics.
    • Fabrication process: TSMC 4 nm FinFET.
    More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
    2. Ryzen AI is only available when paired with a Radeon RX 7000 series graphics card as they feature AI acceleration

    Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)

    Common features of Ryzen 8000G desktop APUs:

    • Socket: AM5.
    • All the CPUs support DDR5-5200 RAM in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
    • Includes integrated RDNA 3 GPU.
    • Includes XDNA AI Engine (Ryzen AI) on upper end models as indicated in table below.
    • Fabrication process: TSMC 4 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores
    2. GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
    3. Zen 4 cores' base frequency / Zen 4c cores' base frequency
    4. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

    Mobile processors

    Ryzen 2000 series

    Raven Ridge (Zen/GCN5 based)

    Common features of Ryzen 2000 notebook APUs:

    • Socket: FP5.
    • The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
    • L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 12 PCIe 3.0 lanes.
    • Includes integrated GCN 5th generation GPU.
    • Fabrication process: GlobalFoundries 14LP.
    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. Branded as Radeon Vega instead of Radeon RX Vega on the PRO CPUs.
    2. Model also available as PRO version as 2300U, 2500U, 2700U, released on May 15, 2018.

    Ryzen 3000 series

    Dalí (Zen/GCN5 based)

    Common features of Ryzen 3000 notebook APUs:

    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Picasso (Zen+/GCN5 based)

    Common features of Ryzen 3000 notebook APUs:

    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Ryzen 4000 series

    Renoir (Zen 2/GCN5 based)

    Common features of Ryzen 4000 notebook APUs:

    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. All of the iGPUs are branded as AMD Radeon Graphics.
    2. Only found on the Microsoft Surface Laptop 4.
    3. Model also available as PRO version as 4450U,[lower-alpha 4] 4650U,[lower-alpha 5] 4750U,[lower-alpha 6] released May 7, 2020.

    Ryzen 5000 series

    Lucienne (Zen 2/GCN5 based)

    Common features of Ryzen 5000 notebook APUs:

    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. All of the iGPUs are branded as AMD Radeon Graphics.

    Cezanne and Barceló (Zen 3/GCN5 based)

    Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:

    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    1. All of the iGPUs are branded as AMD Radeon Graphics.
    2. Model also available as PRO version as 5450U,[58] 5650U,[59] 5850U,[60] released on March 16, 2021 and as 5475U,[61] 5675U,[62] 5875U,[63] released on April 19, 2022.
    3. Model also available as Chromebook optimized version as 5425C,[64] 5625C,[65] 5825C,[66] released on May 5, 2022.

    Ryzen 6000 series

    Rembrandt (Zen 3+/RDNA2 based)

    Common features of Ryzen 6000 notebook APUs:

    • Socket: FP7, FP7r2.
    • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 16 PCIe 4.0 lanes.
    • Includes integrated RDNA 2 GPU.
    • Fabrication process: TSMC 6 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    New naming scheme for future mobile processors

    The table below denotes the naming scheme for AMD's mobile CPU lineups starting with the 7000 series.[70]

    More information Portfolio model number, Market segment ...

    Ryzen 7000 series

    Mendocino (7020 series, Zen 2/RDNA2 based)

    Common features of Ryzen 7020 notebook APUs:

    • Socket: FT6
    • All the CPUs support LPDDR5-5500 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 4 PCIe 3.0 lanes.
    • Includes integrated RDNA 2 GPU.
    • Fabrication process: TSMC 6 nm FinFET.
    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
    3. Model also available as Chromebook optimized version as 7520C[lower-roman 4] and 7320C[lower-roman 5] released on May 23, 2023

    Barcelo-R (7030 series, Zen 3/GCN5 based)

    Common features of Ryzen 7030 notebook APUs:

    More information Branding and Model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Rembrandt-R (7035 series, Zen 3+/RDNA2 based)

    Common features of Ryzen 7035 notebook APUs:

    • Socket: FP7, FP7r2.
    • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 512 KB per core.
    • All the CPUs support 16 PCIe 4.0 lanes.
    • Includes integrated RDNA 2 GPU.
    • Fabrication process: TSMC 6 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX
    2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Phoenix (7040 series, Zen 4/RDNA3/XDNA based)

    Common features of Ryzen 7040 notebook APUs:

    • Socket: FP7, FP7r2, FP8.
    • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 20 PCIe 4.0 lanes.
    • Includes integrated RDNA 3 GPU.
    • Includes XDNA AI Engine (Ryzen AI).
    • Fabrication process: TSMC 4 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
    2. PRO versions launched on 13 June 2023.
    3. China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.

    Dragon Range (7045 series, Zen 4/RDNA2 based)

    Common features of Ryzen 7045 notebook CPUs:

    • Socket: FL1.
    • All the CPUs support DDR5-5200 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 28 PCIe 5.0 lanes.
    • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[lower-roman 1].
    • Fabrication process: TSMC 5 nm FinFET (6 nm FinFET for the I/O and graphics die).
    More information Branding and model, Cores (threads) ...
    1. Core Complexes (CCX) × cores per CCX
    1. Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
    2. Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

    Ryzen 8000 series

    Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)

    Common features of Ryzen 8040 notebook APUs:

    • Socket: FP7, FP7r2, FP8.
    • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 20 PCIe 4.0 lanes.
    • Includes integrated RDNA 3 GPU.
    • Includes XDNA AI Engine (Ryzen AI).
    • Fabrication process: TSMC 4 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

    Handheld gaming PC processors

    Ryzen Z1 series (Zen 4/RDNA3 based)

    Common features of Ryzen Z1 handheld APUs:

    • Socket: FP7, FP7r2, FP8.
    • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
    • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
    • L2 cache: 1 MB per core.
    • All the CPUs support 20 PCIe 4.0 lanes.
    • Includes integrated RDNA 3 GPU.
    • Fabrication process: TSMC 4 nm FinFET.
    More information Branding and model, CPU ...
    1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores

    Embedded processors

    1000 series

    Great Horned Owl (V1000 series, Zen/GCN5 based)

    More information Model, Release date ...
    1. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    Banded Kestrel (R1000 series, Zen/GCN5 based)

    More information Model, Release date ...
    1. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    2000 series

    Grey Hawk (V2000 series, Zen 2/GCN5 based)

    More information Model, Release date ...
    1. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

    River Hawk (R2000 series, Zen+ based)

    3000 series

    (V3000 series, Zen 3+ based)

    More information Model, Release date ...

      7000 series

      (Ryzen Embedded 7000 series, Zen 4/RDNA2 based)

      Common features of Ryzen Embedded 7000 series CPUs:

      • Socket: AM5.
      • All the CPUs support ECC DDR5-5200 dual-channel mode.
      • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
      • L2 cache: 1 MB per core.
      • All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
      • Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
      • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
      More information Processor branding, Model ...
      1. Core Complexes (CCX) × cores per CCX

      See also


      References

      1. Chen, Sam (February 13, 2020). "What is XFR? (AMD)". Gear Primer. Retrieved June 11, 2020.
      2. "HP Desktop Pro A G2 Specifications". HP Customer Support. Retrieved December 23, 2022.
      3. "AMD Radeon Vega 3 Embedded Specs". TechPowerUp. Retrieved April 8, 2023.
      4. Alcorn, Paul (November 14, 2019). "Tom's Hardware Ryzen 9 3950X review". Tom's Hardware. Retrieved May 12, 2020.
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