Integrating electronics onto physical prototypes

In place of flat “breadboards,” 3D-printed CurveBoards enable easier testing of circuit design on electronics products.

Rob Matheson | MIT News Office • mit
March 3, 2020 ~8 min

Cryptographic “tag of everything” could protect the supply chain

Tiny, battery-free ID chip can authenticate nearly any product to help combat losses to counterfeiting.

Rob Matheson | MIT News Office • mit
Feb. 20, 2020 ~8 min

Engineers mix and match materials to make new stretchy electronics

Next-generation devices made with new “peel and stack” method may include electronic chips worn on the skin.

Jennifer Chu | MIT News Office • mit
Feb. 5, 2020 ~8 min

A new facet for germanium

MIT researchers grow perfectly shaped germanium tunnels on silicon oxide with controllable length.

Denis Paiste | Materials Research Laboratory • mit
Jan. 31, 2020 ~10 min

How to verify that quantum chips are computing correctly

A new method determines whether circuits are accurately executing complex operations that classical computers can’t tackle.

Rob Matheson | MIT News Office • mit
Jan. 13, 2020 ~9 min

MIT researchers realize “ideal” kagome metal electronic structure

Newly synthesized compound of iron and tin atoms in 1-to-1 ratio displays unique behavior.

Materials Research Laboratory • mit
Dec. 12, 2019 ~6 min

Toward more efficient computing, with magnetic waves

Circuit design offers a path to “spintronic” devices that use little electricity and generate practically no heat.

Rob Matheson | MIT News Office • mit
Nov. 28, 2019 ~7 min

Nature can help solve optimization problems

A low-cost analog circuit based on synchronizing oscillators could scale up quickly and cheaply to beat out digital computers.

Kylie Foy | Lincoln Laboratory • mit
Oct. 28, 2019 ~9 min

“Electroadhesive” stamp picks up and puts down microscopic structures

New technique could enable assembly of circuit boards and displays with more minute components.

Jennifer Chu | MIT News Office • mit
Oct. 11, 2019 ~7 min

SMART develops a way to commercially manufacture integrated silicon III-V chips

New method from MIT’s research enterprise in Singapore paves the way for improved optoelectronic and 5G devices.

Singapore-MIT Alliance for Research and Technology • mit
Oct. 3, 2019 ~5 min

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